System and method for high speed inspection of semiconductor substrates

A method of manufacturing a semiconductor device, comprising:

• generating two or more third beams of light from at least one of a first beam of light from a first illumination source and a second beam of light from a second illumination source;
• impinging the two or more third beams of light onto a set of two or more first locations on top of a semiconductor substrate;
• in response to the impinged two or more third beams of light, receiving two or more reflected beams of light from the set of two or more first locations;
• and
• determining, based on the received two or more reflected beams, if a defect exists at the set of two or more first locations, wherein the first beam of light is split into two or four beams of light, wherein the second beam of light is split into two or four beams of light, and wherein the two or more third beams of light comprises four parallel beams of light, six parallel beams of light, or eight parallel beams of light.

An inspection system for semiconductor substrates, comprising:

• a beam splitter system configured to split a first beam of light from a first illumination source of one or more illumination sources, to generate two or more second beams of light and to impinge onto two or more first locations on top of a semiconductor substrate;
• and
• two or more beam splitters and two or more light detection systems,
• wherein the two or more beam splitters are positioned such that the two or more second beams of light respectively pass through the two or more beam splitters before impinging onto the two or more first locations, each one of the two or more beam splitters is optically coupled to one of the two or more light detection systems, wherein each one of the two or more light detection systems is configured to receive, through a corresponding beam splitter of the two or more beam splitters, a reflected beam of light from one of the two or more first locations, wherein each one of the two or more light detection systems are configured to generate a detected signal based on the received reflected beam of light, wherein the two or more light detection systems are coupled to an analyzer module configured to receive two or more detected signals, and wherein the analyzer module is configured to determine if a defect exists at the two or more first locations based on the two or more detected signals.