Methods and apparatus for an improved integrated circuit package

A method for forming an integrated circuit (IC) package, comprising:

• providing a lead frame strip of lead frame material having a first side and a second side opposite the first side with integrated circuit (IC) dies attached to the first side of the lead frame strip and covered in molding compound material, the integrated circuit dies spaced apart by saw street regions;
• from the first side of the lead frame strip, in a saw street between ones of the IC dies, making a first cut of a first width through the molding compound and into the first side of the lead frame strip, leaving a band of the lead frame material and molding compound material in the saw street between adjacent IC dies;
• making a second cut of a second width that is less than the first width through the band of the lead frame material and molding compound material in the saw street to form a ledge of saw street material comprised of a plurality of solder joint reinforcement tabs separated by molding compound material;
• and
• removing the molding compound material from between the solder joint reinforcement tabs such that the solder joint reinforcement tabs extend from a periphery of the IC package.