Unit for supplying substrate treating liquid and apparatus for treating substrate including the same
AssigneeSemes Co., Ltd.
InventorsDong Hwa Lee, Dai Geon Yoon, Soo Hong Lee, Ji Hyeon Kim, Dae Sung Kim
Life of this patent
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AssigneeSemes Co., Ltd.
InventorsDong Hwa Lee, Dai Geon Yoon, Soo Hong Lee, Ji Hyeon Kim, Dae Sung Kim
Estimating the term…
A unit for supplying a substrate-treating liquid is provided with a first reservoir and a second reservoir between which a differential pressure is constantly maintained to establish a flow rate, along with a substrate-treating apparatus having the unit for supplying the substrate-treating liquid. The unit for supplying the substrate-treating liquid includes a supply reservoir module and a buffer reservoir module. The supply reservoir module includes a first reservoir for supplying the substrate-treating liquid to an inkjet head unit for jetting the substrate-treating liquid onto a substrate, and a second reservoir for recovering the substrate-treating liquid that remains unused in the inkjet head unit. The buffer reservoir module is configured to provide the substrate-treating liquid to the first reservoir. Differential pressure is constantly maintained between the first reservoir and the second reservoir.
A unit for supplying a substrate-treating liquid, the unit comprising:
A unit for supplying a substrate-treating liquid, the unit comprising:
An apparatus for treating a substrate, comprising:
Dependencies are inferred from the claim text.