Substrate drying device and method of drying substrate using the same preliminary class

A substrate drying device comprising:

• an upper chamber body comprising an inlet configured to introduce supercritical fluid into a chamber space;
• a lower chamber body comprising an outlet configured to discharge the supercritical fluid out of the chamber space;
• and
• a plurality of vibration devices comprising a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space,
• wherein the substrate holders comprise a support pin and a grip pin, the support pin is configured to support a lower surface of the wafer, and the grip pin is configured to grip a side surface of the wafer, and
• wherein the support pin is positioned separately from the grip pin without contacting the grip pin.