Packaged semiconductor devices, and package molds for forming packaged semiconductor devices

A packaged semiconductor device, comprising:

• a leadframe having a lead;
• a semiconductor device on the leadframe;
• and
• a molded package body on the leadframe, the molded package body covering the semiconductor device, the molded package body comprising a first mold body, a second mold body, a mold cavity defined in between the first mold body and the second mold body by the first mold body and the second mold body being brought into contact, a gate in a first side of the mold cavity for supplying liquid mold compound into the mold cavity, a longitudinal vent for releasing gas from the mold cavity in a second side of the mold cavity opposite the first side of the mold cavity, and a transverse vent for releasing gas from the mold cavity in a third side of the mold cavity that extends from the first side of the mold cavity to the second side of the mold cavity and between the first and second sides of the mold cavity,
• wherein the lead extends from the first side of the mold cavity,
• wherein the leadframe comprises a vent support that extends away from the third side of the mold cavity and aligns with the transverse vent.

A packaged semiconductor device, comprising:

• a leadframe;
• a semiconductor device on the leadframe;
• and
• a molded package body on the leadframe, the molded package body covering the semiconductor device, the molded package body comprising a mold cavity, a gate in a first side of the mold cavity for supplying liquid mold compound into the mold cavity, a longitudinal vent for releasing gas from the mold cavity in a second side of the mold cavity opposite the first side of the mold cavity, and a transverse vent for releasing gas from the mold cavity in a third side of the mold cavity that extends from the first side of the mold cavity to the second side of the mold cavity and between the first and second sides of the mold cavity,
• wherein the leadframe comprises a vent support that extends away from the third side of the mold cavity and aligns with the transverse vent.