Semiconductor device package having metal thermal interface material

A semiconductor device package, comprising:

• a package substrate having a first surface;
• a semiconductor device disposed over the first surface of the package substrate;
• a metal lid disposed over the semiconductor device and the package substrate;
• and
• a metal thermal interface material (TIM) interposed between the metal lid and a top surface of the semiconductor device for bonding the metal lid and the semiconductor device, wherein an outermost point of the lateral sidewall is within a boundary of the semiconductor device, and
• wherein there is a gap between a bottom surface of the metal lid and the first surface of the package substrate to make the metal lid separate from the package substrate, wherein the gap extends from an inner wall of the metal lid to an outer wall of the metal lid, and no adhesive is provided in the gap.

A semiconductor device package, comprising:

• a package substrate having a first surface;
• a semiconductor device disposed over the first surface of the package substrate;
• a metal lid disposed over the semiconductor device and the package substrate;
• and
• a solder-based thermal interface material (TIM) interposed between the metal lid and a top surface of the semiconductor device for bonding the metal lid and the semiconductor device, wherein a shape of a lateral sidewall of the solder-based TIM in a longitudinal section is concave arc.