Sacrificial protection layer for environmentally sensitive surfaces of substrates

A method comprising:

• a) providing a semiconductor substrate having sensitive surface;
• and
• b) dispensing a solution comprising a polymer having a ceiling temperature onto the sensitive surface of the semiconductor substrate to form a sacrificial protective layer, wherein the polymer is kinetically trapped to allow storage at a temperature above the ceiling temperature;
• and
• c) transporting the semiconductor substrate in non-vacuum conditions for storage.

A method comprising:

• receiving from storage a semiconductor substrate having a sensitive surface, the sensitive surface covered by a sacrificial protective layer comprising a polymer having a ceiling temperature, wherein the polymer is kinetically trapped to allow storage at a temperature above a ceiling temperature;
• transporting the semiconductor substrate in non-vacuum conditions for storage;
• and
• exposing the sacrificial protective layer to a stimulus to de-polymerize and remove the sacrificial protective layer without damaging the sensitive surface.