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US 12,119,212 B2Granted
Wafer support device
AssigneeSumitomo Osaka Cement Co., Ltd.
InventorsMasaki Hirayama, Tetsuro Itagaki
Life of this patent
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Abstract
A wafer support device includes a dielectric substrate and an RF electrode provided in the dielectric substrate. The RF electrode is divided into a plurality of zone electrodes arranged in a planar direction of the dielectric substrate. The wafer support device has: a short-circuit member interconnecting the plurality of zone electrodes; and a main power supply rod connected to the short-circuit member from a back side of the dielectric substrate.
Claims13
A wafer support device comprising:
- a dielectric substrate;
- an RF electrode provided in the dielectric substrate, wherein the RF electrode is divided into a plurality of zone electrodes arranged in a planar direction of the dielectric substrate;
- a short-circuit member which interconnects the plurality of zone electrodes;
- and
- a main power supply rod which is connected to the short-circuit member from a back side of the dielectric substrate,
- wherein the short-circuit member has a plurality of power supply pins which respectively extend from the plurality of zone electrodes to the back side of the dielectric substrate and exposed to a back surface of the dielectric substrate, and a short-circuit electrode which is positioned on the back surface of the dielectric substrate, interconnects the plurality of power supply pins with each other, and connected to the main power supply rod, and
- wherein the short-circuit electrode is fixed to the plurality of power supply pins in a bent state.
4 more elements
Dependencies are inferred from the claim text.