US 12,119,154 B2Granted

Coil device

AssigneesTDK Corporation, TDK Korea Corporation

InventorsKiyofumi Fujiwara, Hiroyuki Iwata, Eietsu Abe, Sepung Ki, Chihu An

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Abstract

The present invention provides a coil device which includes two coil elements in the same device and achieves an improved wire occupancy. The coil device includes a core including a winding core, and a winding wire part of which a first wire and a second wire are wound in a plurality of layers around the winding core, wherein the winding wire part includes a first part in which the first wire and the second wire of a same turn are wound adjacent to each other on a same layer, and a second part in which the first wire and the second wire of a same turn are wound in different layers without being adjacent to each other.

Claims12

Dependent claims

A coil device comprising

a core including a winding core, and
a winding wire part of which a first wire and a second wire are wound in a plurality of layers around the winding core, wherein
the winding wire part includes
a first part in which the first wire and the second wire of a same turn are wound adjacent to each other on a same layer,
a second part in which the first wire and the second wire of a same turn are wound in different layers without being adjacent to each other, and
a third part in which the first wire and the second wire of a same turn are would in a same layer without being adjacent to each other, and
an inner most layer of the winding wire part contacting the winding core consists of the first part.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/209,761Filed 23 Mar 2021
Priority: JP 2020-05278424 Mar 2020
Published: US 2021/0304943 A130 Sep 2021
Granted: 15 Oct 2024
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

H01F 17/045
With magnetic core: with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
H01F 27/2823
Coils; Windings; Conductive connections: wires
H01F 27/292
Terminals; Tapping arrangements for signal inductances: surface mounted devices
H01F 41/069
Winding non-flat conductive wires, e.g. rods, cables or cords: winding two or more wires, e.g. bifilar winding

Family

US 2021/0304943 A1Pre-grant publication · published 30 Sep 2021
US 12,119,154 B2This patent

From the US filing history. Foreign family members aren’t listed.

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