Method for identifying cause of manufacturing defects
AssigneeNanya Technology Corporation
InventorKen-Huan Ho
Life of this patent
Estimating the term…
Abstract
A method for identifying a cause of manufacturing defects is provided. The method includes capturing, by an image capture unit, a number N of images from a semiconductor wafer, wherein each of the s umber N of images comprises a number M of geometric features, calculating, by a processing unit, a geometric center for each of the geometric features of the number N of images, calculating, based on the number N of images, a number M of average geometric centers associated with the number M of geometric features, and calculating a shift amount for each geometric feature of the number N of images.
Claims10
A method for identifying a cause of manufacturing defects, comprising:
- capturing, by an image capture unit, a number N of images from a semiconductor wafer, wherein each of the number N of images comprises a number M of geometric features;
- calculating, by a processing unit, a geometric center for each of the geometric features of the number N of images;
- calculating, based on the number N of images, a number M of average geometric centers associated with the number M of geometric features;
- and
- calculating a shift amount for each geometric feature of the number N of images based on a difference between the geometric center of a specific geometric feature of the number M of geometric features and the average geometric center associated with the specific geometric feature of the number M of geometric features.
Dependencies are inferred from the claim text.