Method for manufacturing semiconductor structure having conductive block connected to transistor on the substrate

A method for manufacturing a semiconductor structure, comprising:

• providing a substrate;
• forming a bit line structure on the substrate, the bit line structure comprising a plurality of bit lines parallel to and spaced apart from each other, sidewalls and a top portion of each of the plurality of bit lines being wrapped with an insulating structure, and a fill channel being formed between the insulating structures on two adjacent bit lines;
• filling the fill channel with a conductive material to form a conductor;
• the conductor being connected to transistors on the substrate;
• and
• forming at least one slit on the conductor along a direction perpendicular to a longitudinal direction of each of the plurality of bit lines to form a plurality of conductive blocks distributed at intervals on the substrate, each of the plurality of conductive blocks being connected to one of the transistors on the substrate.