Semiconductor structure and method for preparing same

Abstract

A method for preparing a semiconductor structure includes: providing a semiconductor substrate; forming a groove in the semiconductor substrate; forming a first insulation layer, the first insulation layer at least covering an inner wall of the groove; forming a channel layer, the channel layer at least covering an inner wall of the first insulation layer; forming a second insulation layer, the second insulation layer at least covering an inner wall of the channel layer; filling the groove with a word line structure; removing part of the semiconductor substrate, part of the first insulation layer, and part of the channel layer, and forming a recess region in an outer side wall of the second insulation layer; and forming a source-drain in the recess region, the source-drain being electrically connected with the channel layer.

Dependencies are inferred from the claim text.