Heat pipe with in-plane heat spreader and loading mechanism

A method comprising:

• determining a profile of one or more heat pipes;
• determining a profile of one or more loading mechanisms, wherein at least one of the one or more loading mechanisms are comprised of a relatively high expansion material and of a relatively low expansion material;
• cutting a heat spreader to include a profile that matches the profile of the one or more heat pipes;
• cutting the heat spreader to include a profile that at least partially matches the profile of the one or more loading mechanisms;
• securing the one or more heat pipes to the heat spreader;
• and
• securing the one or more loading mechanisms to at least a portion of the one or more heat pipes, wherein the one or more heat pipes, the heat spreader, and the one or more loading mechanisms are all in a same plane.

An electronic device comprising:

• a substrate;
• one or more heat sources over the substrate;
• one or more heat pipes thermally coupled to the one or more heat sources;
• a heat spreader coupled to the one or more heat pipes, wherein the heat spreader is in-plane with the heat pipe;
• and
• one or more loading mechanisms comprised of a bi-metal material, wherein the one or more loading mechanisms are coupled to at least a portion of the one or more heat pipes and to the substrate, wherein the one or more loading mechanisms are in-plane with the heat spreader and the one or more heat pipes.