Power adapter and manufacturing method thereof

A power adapter manufacturing method, comprising:

• forming a first heat dissipation part outside a circuit board assembly by using a glue potting process, wherein the first heat dissipation part fastens a line interface and a power connector to the circuit board assembly;
• disposing the circuit board assembly coated with the first heat dissipation part inside a housing together with the line interface and the power connector, wherein a free end of the power connector penetrates out of the housing, and there is a gap between an outer wall of the first heat dissipation part and an inner wall of the housing;
• disposing a second heat dissipation part on the outer wall of the first heat dissipation part, wherein an end of the second heat dissipation part that faces away from the first heat dissipation part is close to the inner wall of the housing or abuts against the inner wall of the housing;
• and wherein a disposition position of the second heat dissipation part corresponds to a position of an electronic component that generates less heat in the circuit board assembly relative to a heat emitting component of the circuit board assembly.