Composite circuit board and method of manufacturing the same

A composite circuit board, comprising:

• a flexible board, a rigid board, an adhesive layer and a protective adhesive,
• wherein the adhesive layer is disposed between the rigid board and the flexible board and configured to bond the rigid board with the flexible board;
• the rigid board defines a stepped groove that extends through the rigid board, the adhesive layer defines a through slot that extends through the adhesive layer, the stepped groove and the through slot are communicated with each other to form a thinning groove;
• the flexible board is exposed from the thinning groove;
• the protective adhesive covers at least one stepped wall of the thinning groove and at least a part of an exposed region of the flexible board.

A method of manufacturing a composite circuit board, comprising:

• providing a core plate assembly, wherein the core plate assembly comprises a flexible board, a rigid board and an adhesive layer, the adhesive layer is disposed between the rigid board and the flexible board and is configured to bond the rigid board and the flexible board;
• defining a groove in the core plate assembly to define a thinning groove, which extends through the rigid board and the adhesive layer and exposes the flexible board, wherein the thinning groove has at least one stepped wall;
• applying a protective adhesive on the at least one stepped wall, and enabling the protective adhesive to flow to reach the flexible board;
• and
• curing the protection adhesive.