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AssigneeSanDisk Technologies LLC
InventorsVirgil Zhu, Vincent Jiang, Paul Qu, Shixing Zhu, Yuanheng Zhang, Enoch He, Yonglong Liu, Lian Chen, Guangqiang Li, Jingyun Chen
Estimating the term…
A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.
A method of soldering one or more components to a substrate, the method comprising:
A method for soldering one or more electrical components to a substrate comprising an amount of solder material coupling the one or more electrical components to the substrate, the method comprising:
Dependencies are inferred from the claim text.