Method of mounting electronic component, substrate and an optical scanning apparatus

A substrate on which at least one electronic component having at least one first terminal provided along one side of the at least one electronic component and at least one second terminal provided along another side of the at least one electronic component opposed to the one side of the at least one electronic component, the substrate comprising:

• a first copper foil pattern to be soldered with the at least one first terminal;
• a second copper foil pattern to be soldered with the at least one second terminal;
• a first solder portion applied onto the first copper foil pattern;
• and
• a second solder portion applied to the second copper foil pattern,
• wherein a first end of the first solder portion facing the second solder portion is applied to extend toward the second copper foil pattern beyond a first end of the first copper foil pattern facing the second copper foil pattern, and
• wherein a first end of the second solder portion facing the first solder portion is applied to extend toward the first copper foil pattern beyond a first end of the second copper foil pattern facing the first copper foil pattern,
• wherein the first end of the first solder portion is applied to extend toward the second copper foil pattern beyond a first end of the at least one first terminal facing the at least one second terminal, and the first end of the second solder portion is applied to extend toward the first copper foil pattern beyond a first end of the at least one second terminal facing the at least one first terminal.