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US 12,114,427 B2Granted
Method for fabricating assemble substrate
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsLung-Yuan Wang, Wen-Liang Lien
Life of this patent
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Abstract
A method for fabricating an assemble substrate is provided, including stacking a circuit portion on a plurality of circuit members. The circuit members are spaced apart from one another in a current packaging process to increase a layer area. The assemble substrate thus fabricated meets the requirements for a packaging substrate of a large size, and has a high yield and low fabrication cost.
Claims11
A method for fabricating an assemble substrate, comprising:
- providing a plurality of circuit members and at least one circuit portion on a carrying board, and electrically connecting the circuit portion to the plurality of circuit members, wherein the plurality of circuit members are spaced apart from one another, wherein the circuit portion is stacked on two of the plurality of circuit members, wherein the circuit portion and the plurality of circuit members are circuit boards, and wherein the circuit portion has a first width less than or equal to a second width between two of the plurality of circuit members, with the second width being greater than a width between any other two of the plurality of circuit members;
- and
- removing the carrying board.
Dependencies are inferred from the claim text.