Circuit board and probe card
AssigneeKYOCERA Corporation
InventorsYouichiro Honda, Yoshihiro Toda
Life of this patent
Estimating the term…
Abstract
A circuit board includes an insulating substrate having a first surface and a second surface opposite to the first surface, a solid conductor located inside the insulating substrate, a first via conductor connected to the solid conductor from a side of the first surface, and a second via conductor connected to the solid conductor from a side of the second surface. The solid conductor has a cutout that intersects a line segment that connects a node of the first via conductor and a node of the second via conductor to each other.
Claims14
A circuit board comprising:
- an insulating substrate having a first surface and a second surface opposite to the first surface;
- a solid conductor located inside the insulating substrate;
- a first via conductor connected to the solid conductor from a side of the first surface;
- and
- a second via conductor connected to the solid conductor from a side of the second surface, wherein
- the solid conductor has a cutout that intersects a line segment that connects a node of the first via conductor and a node of the second via conductor to each other,
- wherein
- the solid conductor includes first and second solid conductors located in different layers of the insulating substrate and made conductive with each other, and
- each of the first and second solid conductors has the cutout, and
- wherein
- the cutout of the solid conductor on a voltage-supplied side is larger than the cutout of the solid conductor on a voltage-output side between the first solid conductor and the second solid conductor.
A circuit board comprising:
- an insulating substrate having a first surface and a second surface opposite to the first surface;
- a solid conductor located inside the insulating substrate;
- a first via conductor connected to the solid conductor from a side of the first surface;
- and
- a second via conductor connected to the solid conductor from a side of the second surface,
- a first electrode located on the first surface and electrically connected to the solid conductor through the first via conductor;
- and
- a second electrode located on the second surface and electrically connected to the solid conductor through the second via conductor,
- wherein
- the solid conductor has a cutout that intersects a line segment that connects a node of the first via conductor and a node of the second via conductor to each other,
- wherein
- the solid conductor includes first and second solid conductors located in different layers of the insulating substrate and made conductive with each other, and
- each of the first and second solid conductors has the cutout, and
- wherein
- the cutout of the solid conductor on a voltage-supplied side is larger than the cutout of the solid conductor on a voltage-output side between the first solid conductor and the second solid conductor.
A circuit board comprising:
- an insulating substrate having a first surface and a second surface opposite to the first surface;
- a solid conductor located inside the insulating substrate;
- a first via conductor connected to the solid conductor from a side of the first surface;
- and
- a second via conductor connected to the solid conductor from a side of the second surface, wherein
- the solid conductor has a cutout that intersects a line segment that connects a node of the first via conductor and a node of the second via conductor to each other,
- wherein the cutout has a slit shape,
- wherein
- the solid conductor includes first and second solid conductors located in different layers of the insulating substrate and made conductive with each other, and
- each of the first and second solid conductors has the cutout, and
- wherein
- the cutout of the solid conductor on a voltage-supplied side is larger than the cutout of the solid conductor on a voltage-output side between the first solid conductor and the second solid conductor.
Dependencies are inferred from the claim text.