Electronic module and electronic device

An electronic module, comprising:

• a first component and a second component, wherein the first component is fitted with the second component in a sliding manner along a first preset direction, and locked at a first specified position relative to the second component, wherein a surface of the first component facing the second component is provided with a plurality of first solder pads;
• and
• a plurality of terminals, one-to-one corresponding to at least a portion of the plurality of first solder pads, wherein each terminal comprises a body part and a first bent part connected to the body part, wherein the body part is fastened to the second component, and the first bent part presses against a corresponding first solder pad;
• and
• the first component and the second component are configured such that, when the first component slides relative to the second component along the first preset direction before said locking at the first specified position relative to the second component, a torque of a friction force applied by the first component to a first bent part of said each terminal is less than or equal to that applied by the body part to the first bent part,
• wherein the first component comprises a package substrate and a chip, the package substrate comprises a substrate body and the plurality of first solder pads, the plurality of first solder pads and the chip are respectively disposed on two opposite surfaces of the substrate body, and the chip is electrically connected to the plurality of first solder pads,
• wherein the second component comprises a circuit board and a mount base, the circuit board comprises a circuit board body and a plurality of second solder pads disposed on the circuit board body,
• wherein the plurality of terminals are one-to-one connected to the plurality of second solder pads,
• wherein the mount base is connected to the circuit board, and body parts of the plurality of terminals pass through the mount base and are fastened to the mount base,
• wherein the circuit board further comprises a plurality of traces formed on the circuit board body, and the plurality of traces and at least a portion of the terminals are in signal connection in a one-to-one correspondence, and when the plurality terminals are distributed in an array, each trace extends along two adjacent columns of terminals and/or a middle position between the two adjacent columns of terminals, and is parallel to an arrangement direction of terminals on two sides of the trace.