Circuit board
AssigneeSumitomo Bakelite Co., Ltd.
InventorNobuo Tagashira
Life of this patent
Estimating the term…
Abstract
A heat radiating substrate (10) includes an insulating layer (11) and a circuit pattern (20) of a metal formed on the insulating layer (11) in direct contact with the insulating layer (11), in which a side surface (that is, metal layer side surface (23)) of the circuit pattern (20) has a region in which an angle θ formed by a surface (insulating layer upper surface (11a)) of the insulating layer (11) (insulating substrate) and a tangential line L at a middle portion (X1) in a height direction in a cross-sectional view perpendicular to an extending direction of the metal is 80 degrees or more and 100 degrees or less.
Claims5
A circuit board comprising:
- an insulating substrate;
- and
- a circuit pattern of a metal formed on the insulating substrate in direct contact with the insulating substrate,
- wherein a side surface of the circuit pattern has a region in which an angle formed by a surface of the insulating substrate and a tangential line at a middle portion in a height direction in a cross-sectional view perpendicular to an extending direction of the metal is 80 degrees or more and 100 degrees or less,
- wherein in a case where a height of the circuit pattern is denoted by D, the side surface of the circuit pattern exhibits a straight line in the cross-sectional view perpendicular to the extending direction of the metal, in a height range of 0.4D or more and 0.6D or less in a perpendicular direction from the insulating substrate, and
- wherein the side surface of the circuit pattern exhibits a trailing-tailed shape at an interface with the insulating substrate.
A circuit board comprising:
- an insulating substrate;
- and
- a circuit pattern of a metal formed on the insulating substrate in direct contact with the insulating substrate,
- wherein a side surface of the circuit pattern has a region in which an angle formed by a surface of the insulating substrate and a tangential line at a middle portion in a height direction in a cross-sectional view perpendicular to an extending direction of the metal is 80 degrees or more and 100 degrees or less,
- wherein the side surface of the circuit pattern exhibits a trailing-tailed shape at an interface with the insulating substrate, and
- wherein in a case where a height of the circuit pattern is denoted by b and a distance from an adjacent circuit pattern in a middle portion of the height of the circuit pattern is denoted by a, a region in which an aspect ratio b/a is 0.2 or more and 5 or less is provided.
Dependencies are inferred from the claim text.