Layout structure and method for fabricating same

A layout structure, comprising:

• a frequency divider pattern layer comprising a first frequency divider region, a second frequency divider region, a third frequency divider region and a fourth frequency divider region arranged centrosymmetrically;
• and
• a conductor pattern layer comprising a first sub-conductor pattern layer and a second sub-conductor pattern layer stacked;
• wherein the first sub-conductor pattern layer is configured to communicate the first frequency divider region with the second frequency divider region, and communicate the third frequency divider region with the fourth frequency divider region;
• and
• the second sub-conductor pattern layer is configured to communicate the first frequency divider region with the third frequency divider region, and communicate the second frequency divider region with the fourth frequency divider region;
• and
• the first frequency divider region is configured to form a first frequency divider, the second frequency divider region is configured to form a second frequency divider, the third frequency divider region is configured to form a third frequency divider, and the fourth frequency divider region is configured to form a fourth frequency divider;
• the first sub-conductor pattern layer comprises a first conductor pattern, a second conductor pattern, a third conductor pattern and a fourth conductor pattern sequentially arranged along a first direction;
• and
• the second sub-conductor pattern layer comprises a fifth conductor pattern, a sixth conductor pattern, a seventh conductor pattern, an eighth conductor pattern, a ninth conductor pattern, a tenth conductor pattern, an eleventh conductor pattern, and a twelfth conductor pattern, wherein
• wherein a terminal of the first conductor pattern communicates the fifth conductor pattern, and other terminal of the first conductor pattern communicates the ninth conductor pattern;
• a terminal of the second conductor pattern communicates the seventh conductor pattern, and other terminal of the second conductor pattern communicates the eleventh conductor pattern;
• a terminal of the third conductor pattern communicates the eighth conductor pattern, and other terminal of the third conductor pattern communicates the twelfth conductor pattern;
• and
• a terminal of the fourth conductor pattern communicates the sixth conductor pattern, and other terminal of the fourth conductor pattern communicates the tenth conductor pattern.

A method for fabricating a layout structure, comprising:

• providing a frequency divider pattern layer, wherein the frequency divider pattern layer comprises a first frequency divider region, a second frequency divider region, a third frequency divider region and a fourth frequency divider region arranged centrosymmetrically;
• and
• forming a conductor pattern layer on the frequency divider pattern layer, wherein the conductor pattern layer comprises a first sub-conductor pattern layer and a second sub-conductor pattern layer stacked;
• wherein the first sub-conductor pattern layer is configured to communicate the first frequency divider region with the second frequency divider region, and communicate the third frequency divider region with the fourth frequency divider region;
• the second sub-conductor pattern layer is configured to communicate the first frequency divider region with the fourth frequency divider region, and communicate the second frequency divider region with the third frequency divider region;
• or, the second sub-conductor pattern layer is configured to communicate the first frequency divider region with the third frequency divider region, and communicate the second frequency divider region with the fourth frequency divider region;
• the first frequency divider region is configured to form a first frequency divider, the second frequency divider region is configured to form a second frequency divider, the third frequency divider region is configured to form a third frequency divider, and the fourth frequency divider region is configured to form a fourth frequency divider;
• and
• the first sub-conductor pattern layer comprises a first conductor pattern, a second conductor pattern, a third conductor pattern, and a fourth conductor pattern, wherein
• the first conductor pattern communicates an output terminal of the first frequency divider with a first data input terminal of the second frequency divider;
• the second conductor pattern is connected to a second data input terminal of the second frequency divider;
• the third conductor pattern is connected to a second data input terminal of the fourth frequency divider;
• and
• the fourth conductor pattern communicates an output terminal of the third frequency divider with a first data input terminal of the fourth frequency divider.