Multilayer electronic component

A multilayer electronic component comprising:

• a stack including a plurality of dielectric layers that are stacked together;
• a first inductor integrated with the stack and wound about a first axis orthogonal to a stacking direction of the plurality of dielectric layers;
• a second inductor integrated with the stack and wound about a second axis orthogonal to the stacking direction;
• a first port;
• a second port;
• and
• a signal path connecting the first port and the second port, wherein
• the first inductor and the second inductor are each provided between the signal path and ground in circuit configuration,
• an area of a first region obtained by perpendicularly projecting a first space including the first axis and surrounded by the first inductor onto a virtual plane perpendicular to the first axis and an area of a second region obtained by perpendicularly projecting a second space including the second axis and surrounded by the second inductor onto a virtual plane perpendicular to the second axis are different from each other,
• the second inductor is disposed such that at least part of the second space overlaps part of the first space in a view in one direction parallel to the second axis,
• the first inductor includes a first through hole column, a second through hole column, a first conductor layer portion, a second conductor layer portion, and a third conductor layer portion,
• the first through hole column and the second through hole column are each constituted by two or more through holes connected in series to each other,
• the first conductor layer portion, the second conductor layer portion, and the third conductor layer portion each include at least one conductor layer,
• the first conductor layer portion connects one end of the first through hole column and one end of the second through hole column,
• the second conductor layer portion is connected to another end of the first through hole column and extends close to another end of the second through hole column,
• the third conductor layer portion is connected to the another end of the second through hole column and extends close to the another end of the first through hole column,
• the second inductor includes a first conductor portion and a second conductor portion each wound less than once about the second axis, and a connection portion connecting the first conductor portion and the second conductor portion,
• the second conductor portion is provided between the first conductor portion and the ground in circuit configuration, and
• the first conductor portion and the first inductor are magnetically coupled to each other.