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US 12,113,331 B2Granted
System and apparatus for sequential transient liquid phase bonding
AssigneeAeva, Inc.
InventorsZhizhong Tang, Pradeep Srinivasan, Kevin Masuda, Wenjing Liang
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Abstract
Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.
Claims20
A method for performing sequential bonding, said method comprising:
- receiving a substrate having a plurality of receiving pads to a stage, wherein a first and second receiving pads of said plurality of receiving pads each comprise a first metal alloy;
- attaching a first semiconductor chip to said first receiving pad using a first pickup head, said first semiconductor chip comprising a first metal layer;
- raising a temperature of said first semiconductor chip using a first heating unit coupled to said first pickup head according to a first temperature profile to cause intermixing of said first metal layer on said first semiconductor chip and said first metal alloy of said first receiving pad to form a second metal alloy having a higher melting point than said first metal alloy;
- attaching a second semiconductor chip to said second receiving pad using a second pickup head, said second semiconductor chip comprising a second metal layer;
- and
- raising a temperature of said second semiconductor chip by a second heating unit coupled to said second pickup head according to a second temperature profile to cause intermixing of said second metal layer on said second semiconductor chip and said first metal alloy of said second receiving pad to form a third metal alloy having a higher melting point than said first metal alloy;
- wherein said first predetermined temperature profile comprises temperature set points and time durations and is substantially similar to said second predetermined temperature profile.
4 more elements
Dependencies are inferred from the claim text.