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US 12,113,329 B2Granted
Stem for semiconductor package including eyelet and lead
AssigneeShinko Electric Industries Co., Ltd.
InventorMasao Kainuma
Life of this patent
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Abstract
A stem for a semiconductor package includes an eyelet having a through hole formed therethrough, a lead extending through the through hole, and a sealing part configured to seal the through hole around the lead, wherein a main material of the eyelet is 45% Ni—Fe, and wherein a thermal expansion coefficient of the eyelet is greater than a thermal expansion coefficient of the sealing part.
Claims10
A stem for a semiconductor package, comprising:
- an eyelet having a through hole formed therethrough;
- a lead extending through the through hole;
- and
- a sealing part configured to seal the through hole around the lead,
- wherein a main material of the eyelet has a nickel content of 45% and an iron content of 55%, and
- wherein a thermal expansion coefficient of the eyelet is greater than a thermal expansion coefficient of the sealing part.
3 more elements
Dependencies are inferred from the claim text.