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US 12,113,321 B1Granted
Terminal
AssigneeNapra Co., Ltd.
InventorShigenobu Sekine
Life of this patent
Estimating the term…
Abstract
According to this invention, provided is a terminal having a plating layer formed on a surface of a base, the plating layer having a structure in which an intermetallic compound crystal that contains Sn, Cu, Cr and Ni, is dispersed in a parent phase that contains Sn and an Sn—Cu alloy.
Claims6
A terminal having a plating layer formed on a surface of a base,
- the plating layer having a structure in which an intermetallic compound crystal that contains Sn, Cu, Cr and Ni, is dispersed in a parent phase that contains Sn and an Sn—Cu alloy,
- wherein the intermetallic compound crystal has a chemical composition represented by:
- 50 to 70% by mass of Sn;
- 30 to 50% by mass of Cu;
- 0.001 to 3% by mass of Cr;
- and
- 0.01 to 6.5% by mass of Ni.
4 more elements
A bump having a plating layer formed on a surface of a base,
- the plating layer having a structure in which an intermetallic compound crystal that contains Sn, Cu, Cr and Ni, is dispersed in a parent phase that contains Sn and an Sn—Cu alloy,
- wherein the intermetallic compound crystal has a chemical composition represented by:
- 50 to 70% by mass of Sn:
- 30 to 50% by mass of Cu;
- 0.001 to 3% by mass of Cr;
- and
- 0.01 to 6.5% by mass of Ni.
4 more elements
Dependencies are inferred from the claim text.