Antenna assembly for a vehicle
AssigneeAirgain Incorporated
InventorsLarry Greenstein, Joe L. Romack
Life of this patent
Estimating the term…
Abstract
A heat dissipation system for an antenna assembly for a vehicle is disclosed that provides enhanced heat removal attributes and that provides heat transfer from various components to a heat sink through different heat transfer flow paths to reduce the transfer of heat from high heat producing components to heat sensitive components. Improved heat insulation components can be added to maximize the thermal isolation between heat producing components and to prevent heat transferred from the vehicle into the antenna assembly.
Claims8
A heat dissipation system for an antenna assembly for a vehicle, the antenna assembly having a modem that generates heat during operation and an amplifier, the heat dissipation system comprising:
- a base comprising a sidewall, a component mounting surface and a heat sink, the heat sink comprising a plurality of heat dissipation elements;
- and
- a first heat transfer plate in thermal contact with the modem;
- a second heat transfer plate mounted on the amplifier;
- wherein the modem is disposed on the component mounting surface;
- wherein the first heat transfer plate is in thermal contact with a first area of the heat sink;
- wherein the second heat transfer plate is in thermal contact with a second area of the heat sink;
- wherein the first area of the heat sink is located on one side of the base, the second area of the heat sink is located on an opposing side of the base, and a third area of the heat sink is located at a rear section of the base.
A heat dissipating antenna assembly for a vehicle comprising:
- a base comprising a sidewall, a component mounting surface and a heat sink, the heat sink comprising a plurality of heat dissipation elements;
- a modem disposed on the component mounting surface;
- an amplifier disposed on the component mounting surface;
- an antenna board disposed within the base and comprising a plurality of antenna elements;
- a first heat transfer plate in thermal contact with a first area of the heat sink and the modem;
- a second heat transfer plate mounted on the amplifier and in thermal contact with a second area of the heat sink;
- wherein the first area of the heat sink is located on one side of the base, the second area of the heat sink is located on an opposing side of the base, and a third area of the heat sink is located at a rear section of the base.
Dependencies are inferred from the claim text.