Dual-stripline with crosstalk cancellation

A package substrate, comprising:

• a plurality of alternating organic dielectric layers and metal layers;
• and
• a dual-stripline structure in the plurality of alternating organic dielectric layers and metal layers, the dual-stripline structure comprising:
• a first region comprising a first top line vertically over a first bottom line, and a second top line vertically over a second bottom line;
• a second region comprising the first top line vertically over the second bottom line, and the second top line vertically over the first bottom line;
• and
• a transition region between the first region and the second region, wherein the first bottom line and the second bottom line cross in the transition region.

A semiconductor die, comprising:

• a semiconductor substrate;
• a plurality of alternating dielectric layers and metal layers above the semiconductor substrate;
• and
• a dual-stripline structure in the plurality of alternating dielectric layers and metal layers, the dual-stripline structure comprising:
• a first region comprising a first top line vertically over a first bottom line, and a second top line vertically over a second bottom line;
• a second region comprising the first top line vertically over the second bottom line, and the second top line vertically over the first bottom line;
• and
• a transition region between the first region and the second region, wherein the first bottom line and the second bottom line cross in the transition region.