Fabrication of surface mount microstrip circulators using a ferrite and ceramic dielectric assembly substrate
AssigneeSkyworks Solutions, Inc.
InventorsIain Alexander Macfarlane, Scott David Wilson, David Bowie Cruickshank, Michael David Hill
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Abstract
A method of forming an integrated microstrip circulator includes translating a ferrite disc into an aperture in a dielectric substrate, securing the ferrite disc in the dielectric substrate with an adhesive to form a composite structure, and forming circuitry on an upper surface of the composite structure and forming surface mount contacts on a lower surface of the composite structure by metallizing the upper and lower surfaces of the composite structure.
Claims20
A method of forming an integrated microstrip circulator, the method comprising:
- translating a ferrite disc into an aperture in a dielectric substrate;
- securing the ferrite disc in the dielectric substrate with an adhesive to form a composite structure;
- and
- forming circuitry on an upper surface of the composite structure and forming surface mount contacts on a lower surface of the composite structure by metallizing the upper and lower surfaces of the composite structure.
A method of forming an integrated microstrip circulator, the method comprising:
- preparing a ferrite disc;
- preparing a dielectric substrate, the dielectric substrate having an aperture;
- translating the ferrite disc into the aperture in the dielectric substrate;
- securing the ferrite disc in the dielectric substrate with an adhesive to form a composite structure;
- and
- forming circuitry on an upper surface of the composite structure and forming surface mount contacts on a lower surface of the composite structure by metallizing the upper and lower surfaces of the composite structure.
A method of forming a radio frequency antenna system, the method comprising:
- forming a microstrip circulator surface mounted on an external substrate, the microstrip circulator including a dielectric substrate having an aperture, a ferrite disc secured within the aperture in the dielectric substrate, metallization on upper surfaces of the dielectric substrate and ferrite disc, and surface mount contacts disposed on lower surfaces of the dielectric substrate and ferrite disc and in electrical communication with the metallization on the upper surfaces of the dielectric substrate and ferrite disc;
- disposing a transmit power amplifier on the external substrate in electrical communication with the microstrip circulator;
- disposing a receive low noise amplifier on the external substrate in electrical communication with the microstrip circulator;
- and
- disposing a filter on the external substrate in electrical communication with the microstrip circulator.
Dependencies are inferred from the claim text.