Package structure having packaged light detecting components within and package method thereof

A package method, comprising steps of:

• preparing a circuit board and multiple packaged light detecting components;
• mounting the multiple packaged light detecting components on a mounting surface of the circuit board to connect the multiple packaged light detecting components to a circuit layer of the circuit board;
• preparing a sealing cap;
• wherein the sealing cap is light transmittable and has a first surface and an opposite second surface;
• preparing multiple light filtering films;
• mounting the multiple light filtering films onto the first surface of the sealing cap;
• preparing a supporting annular wall having two opposite ends, and adhesively bonding one of the ends of the supporting annular wall to the mounting surface of the circuit board;
• adhesively bonding the first surface of the sealing cap to the other end of the supporting annular wall, such that the projection of each light filtering film on the mounting surface of the circuit board corresponds to a respective one of the multiple packaged light detecting components;
• wherein the sealing cap includes a patterned shading layer;
• wherein a projection pattern of the patterned shading layer on the circuit board corresponds to a gap between the multiple packaged light detecting components;
• wherein the patterned shading layer of the sealing cap has a grid pattern;
• and
• wherein light transmittable square parts of the patterned shading layer each correspond to a respective one of the multiple packaged light detecting components.