LED chip transfer method and display panel

An LED chip transfer method, comprising:

• providing a driving substrate having at least one set of binding points, the at least one set of binding points comprising a first binding point and a second binding point;
• forming a compensation layer covering the first binding point and the second binding point on the driving substrate;
• providing a chip substrate comprising a substrate and a plurality of chips, each of the plurality of chips comprising a chip body, a first pin and a second pin, the first pin and the second pin being disposed on a side of the chip body away from the substrate;
• performing first alignment processing between the chip substrate and the driving substrate, forming a first groove in the compensation layer by using the first pin, and forming a second groove in the compensation layer by using the second pin, the second groove being spaced from the first groove, the first groove and the second groove having the same profiles as the first pin and the second pin;
• patterning the compensation layer after the first groove and the second groove are formed in the compensation, forming a first via hole and a second via hole spaced from each other by the first groove and the second groove in the compensation layer, the first via hole exposing at least a portion of the first binding point, and the second via hole exposing at least a portion of the second binding point;
• forming a first transfer electrode and a second transfer electrode disconnected from each other on the compensation layer, the first transfer electrode coated on surfaces of the first via hole and the first groove, the first transfer electrode having a portion located in the first groove and a portion overlapped with the first binding point through the first via hole, the second transfer electrode coated on surfaces of a second via hole and the second groove, the second transfer electrode having a portion located in the second groove and a portion overlapped with the second binding point through the second via hole;
• performing a second alignment process between the chip substrate and the driving substrate, so that the first pin is inserted into the first groove and bound with the portion of the first transfer electrode in the first groove, and the second pin is inserted into the second groove and bound with the portion of the second transfer electrode in the second groove, wherein an orthographic projection of the first binding point and the second binding point on the driving substrate is at least partially non-overlapping with an orthographic projection of the first pin and the second pin on the driving substrate;
• and wherein the first groove and the second groove are located between the first via hole and the second via hole;
• and
• stripping the substrate from the chip after the second alignment process is performed between the chip substrate and the driving substrate.