Die to die interface circuit
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTze-Chiang Huang, King-Ho Tam, Yu-Hao Liu
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Abstract
Disclosed herein are related to an integrated circuit including multiple dies stacked along a direction. In one aspect, the integrated circuit includes a first die, a second die, and a third die stacked along the direction. In one aspect, the first die includes a first interface circuit to generate a signal. In one aspect, the second die includes a second interface circuit to receive the signal from the first interface circuit and generate a replicate signal of the signal. In one aspect, the third die includes a third interface circuit to receive the replicate signal from the second interface circuit.
Claims18
An integrated circuit comprising:
- a first die including a first interface circuit;
- a second die disposed above and operatively coupled to the first die, and including a second interface circuit;
- and
- a third die disposed below and operatively coupled to the first die, and including a third interface circuit;
- wherein each of the first to third interface circuits is configured to propagate a signal between a first metal rail and a second metal rail of a corresponding one of the first to third dies, while being configured to electrically isolate between an electrical load of the first metal rail and an electrical load of the second metal rail of any other one of the first to third dies.
An integrated circuit comprising:
- a first die including a first front layer and a first back layer, with a first interface circuit disposed in the first back layer;
- a second die including a second front layer and a second back layer, with a second interface circuit disposed in the second back layer;
- and
- a third die including a third front layer and a third back layer, with a third interface circuit disposed in the third back layer;
- wherein each of the first to third interface circuits is configured to propagate a signal between a first metal rail and a second metal rail of a corresponding one of the first to third dies, while being configured to electrically isolate between an electrical load of the first metal rail and an electrical load of the second metal rail of any other one of the first to third dies.
Dependencies are inferred from the claim text.