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US 12,113,040 B2Granted
Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsTomoyuki Asada, Eri Fukuda, Daisuke Tsunami
Life of this patent
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Abstract
A semiconductor device according to the invention of the present application includes a support, a semiconductor chip provided on the support and a die bond material for bonding a back surface of the semiconductor chip to the support, wherein a plurality of cutouts is formed at edges formed between the back surface and side surfaces of the semiconductor chip connected to the back surface, and the die bond material is provided integrally over the plurality of cutouts.
Claims13
A semiconductor device, comprising:
- a support;
- a semiconductor chip provided on the support;
- and
- a die bond material for bonding a back surface of the semiconductor chip to the support,
- wherein a plurality of cutouts is formed at edges formed between the back surface and side surfaces of the semiconductor chip connected to the back surface,
- the die bond material is one continuous piece over the plurality of cutouts, and
- each of the plurality of cutouts passes through the semiconductor chip from the back surface to an upper surface opposite to the back surface.
4 more elements
A semiconductor device, comprising:
- a support;
- a semiconductor chip provided on the support;
- and
- a die bond material for bonding a back surface of the semiconductor chip to the support, wherein
- the semiconductor chip includes a transparent or semitransparent semiconductor substrate provided on the support,
- a plurality of recesses is formed in an outer peripheral portion of a back surface of the semiconductor substrate, the back surface facing to the support, and
- the die bond material is one continuous piece over the plurality of recesses.
4 more elements
A semiconductor device, comprising:
- a support;
- a semiconductor chip provided on the support;
- and
- a die bond material for bonding a back surface of the semiconductor chip to the support, wherein
- the semiconductor chip includes a semiconductor substrate provided on the support,
- a plurality of recesses is formed in an outer peripheral portion of the semiconductor substrate, each of the recesses passing through the semiconductor substrate from a back surface facing to the support to an upper surface opposite to the back surface,
- the semiconductor chip includes a plurality of conductors each of which is embedded in a corresponding one of the plurality of recesses from the upper surface side of the semiconductor substrate, and
- the die bond material is one continuous piece over the plurality of recesses.
5 more elements
Dependencies are inferred from the claim text.