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US 12,113,030 B2Granted
Electronic component module comprising shield and sealing resin covering electronic components
AssigneeMurata Manufacturing Co., Ltd.
InventorsTadashi Nomura, Yoshihito Otsubo
Life of this patent
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Abstract
A module substrate, a sealing resin portion, and a shield are provided. The shield is provided to cover each of the sealing resin portion and a peripheral side surface of the module substrate. The shield is connected to a ground electrode. On the peripheral side surface, the shield is separated into a first surface side and a second surface side.
Claims20
An electronic component module comprising:
- a module substrate including a first surface, a second surface located opposite to the first surface, and a peripheral side surface connecting the first surface and the second surface to each other, electronic components being mounted on each of the first surface and the second surface;
- a sealing resin portion provided on at least one of the first surface and the second surface, the electronic component being sealed with the sealing resin portion;
- and
- a shield provided to cover each of the sealing resin portion and the peripheral side surface, wherein
- the module substrate is provided with a ground electrode,
- the shield is connected to the ground electrode, and
- a recess is located along the peripheral side surface, such that the shield is separated into a first surface side and a second surface side.
4 more elements
An electronic component module comprising
- a module substrate including a first surface, a second surface located opposite to the first surface, and a peripheral side surface connecting the first surface and the second surface to each other, an electronic component being mounted on at least one of the first surface and the second surface;
- a sealing resin portion provided on at least one of the first surface and the second surface, the electronic component being sealed with the sealing resin portion;
- and
- a shield provided to cover each of the sealing resin portion and the peripheral side surface, wherein
- the module substrate is provided with a ground electrode,
- the shield is connected to the ground electrode, and
- on the peripheral side surface, the shield is separated into a first surface side and a second surface side,
- wherein
- the peripheral side surface is provided with at least one recess, and
- on the peripheral side surface, the shield is separated into the first surface side and the second surface side by the at least one recess.
7 more elements
Dependencies are inferred from the claim text.