Back to results
US 12,113,023 B2Granted
Microelectronic structures including bridges
AssigneeIntel Corporation
InventorsOmkar G. Karhade, Nitin A. Deshpande
Life of this patent
Estimating the term…
Abstract
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
Claims14
A microelectronic assembly, comprising:
- a microelectronic component;
- a substrate;
- and
- a patch structure, wherein the patch structure is coupled between the microelectronic component and the substrate, the patch structure includes an embedded bridge component, the patch structure includes a stack of conductive pillars, each pillar in the stack has a constant diameter along its length, and the diameters of the conductive pillars increase from one pillar to another in a direction from the substrate to the microelectronic component.
1 more element
A microelectronic assembly, comprising:
- a microelectronic component;
- a substrate;
- and
- a patch structure, wherein the patch structure is coupled between the microelectronic component and the substrate, the patch structure has a first face and an opposing second face, the second face is between the first face and the microelectronic component, the patch structure includes an embedded bridge component, the patch structure includes a stack of conductive pillars, each pillar in the stack of conductive pillars has a constant diameter along its length, and the diameter of a conductive pillar proximate to the first face is less than the diameter of a conductive pillar proximate to the second face.
1 more element
Dependencies are inferred from the claim text.