Semiconductor device and method of manufacturing the same

A semiconductor device, comprising:

• a semiconductor module including a plurality of semiconductor chips and a plurality of external connection terminals, the plurality of external connection terminals being electrically connected to respective ones of the plurality of semiconductor chips and each extending outside the semiconductor module;
• and
• a bus bar including a laminated body that includes a flat plate-shaped first conductive member, a flat plate-shaped organic insulating member and a flat plate-shaped second conductive member that are directly and sequentially laminated in this order in a lamination direction, the organic insulating member having a void or a surface with roughness, the laminated body having a plurality of insertion holes into which the plurality of external connection terminals are respectively inserted, the first and second conductive members having end portions that respectively form a first external connection portion and a second external connection portion, the bus bar being sealed with a sealing material with the plurality of insertion holes and the first and second external connection portions being exposed outside of the sealing material, wherein
• the semiconductor module has a main body that is rectangular in a plan view of the semiconductor device,
• the plurality of external connection terminals are aligned in an alignment direction along a long side of the main body, and
• the first external connection portion and the second external connection portion each extend in a direction perpendicular to the alignment direction.