Semiconductor chip package including lead frame and manufacturing method thereof
AssigneeDiodes Incorporated
InventorShiau-Shi Lin
Life of this patent
Estimating the term…
Abstract
A semiconductor chip package may include a lead frame having a first surface and a second surface opposite to each other. A groove may be provided on the first surface of the lead frame and filled with an adhesive. A semiconductor chip may be disposed over the first groove and affixed on the first surface of the lead frame through the adhesive in the first groove. A carrier may be disposed on the second surface of the lead frame. A method for manufacturing the semiconductor chip package is also provided.
Claims19
A semiconductor chip package, comprising:
- a lead frame having a first surface and a second surface opposite to each other;
- a first groove provided on the first surface of the lead frame and filled with an adhesive;
- and
- a semiconductor chip disposed on the first surface, wherein the semiconductor chip is over the first groove and affixed on the lead frame through the adhesive in the first groove;
- and
- wherein the lead frame further comprises:
- a chip pad, on which the first groove is provided and the semiconductor chip is affixed;
- and
- a drain lead contact separated from the chip pad.
A semiconductor chip package, comprising:
- a lead frame having a first surface and a second surface opposite to each other, with a first groove provided on the first surface of the lead frame;
- an adhesive filled in the first groove;
- a semiconductor chip disposed on the first surface and the adhesive;
- and
- a carrier provided on the second surface of the lead frame carrying the lead frame and the semiconductor chip;
- and
- wherein the lead frame further comprises:
- a chip pad, on which the first groove is provided and the semiconductor chip is affixed;
- and
- a drain lead contact separated from the chip pad.
A method for manufacturing a semiconductor chip package, comprising:
- obtaining a lead frame, wherein the lead frame has a first surface and a second surface opposite to each other, with a first groove provided on the first surface of the lead frame;
- filling an adhesive in the first groove;
- and
- disposing a semiconductor chip on the first surface and the adhesive, wherein the semiconductor chip covers the first groove;
- and
- wherein the lead frame further comprises:
- a chip pad, on which the first groove is provided and the semiconductor chip is affixed;
- and a drain lead contact separated from the chip pad.
Dependencies are inferred from the claim text.