Electronic package and manufacturing method thereof

A method of manufacturing an electronic package, comprising:

• disposing at least an electronic element and a plurality of first conductive elements on a circuit structure, wherein the circuit structure is electrically connected to the electronic element and the plurality of first conductive elements;
• forming a first packaging layer on the circuit structure, wherein the first packaging layer covers the electronic element and the plurality of first conductive elements to form a first packaging module;
• and
• disposing a second packaging module on the first packaging layer of the first packaging module, wherein the second packaging module comprises a routing structure, a plurality of second conductive elements disposed on the routing structure and a second packaging layer formed on the routing structure to cover the plurality of second conductive elements, and wherein the routing structure is overlapped on the circuit structure, each of the second conductive elements is correspondingly and directly bonded with and electrically connected to each of the first conductive elements, and the second packaging module is disposed on the first packaging layer of the first packaging module via the second packaging layer.