Plurality of transistors attached to a heat sink with a periphery notch

A semiconductor device comprising:

• a heat dissipation plate formed in a plate shape;
• a plurality of switching elements joined to one surface of the heat dissipation plate;
• a first terminal extending in a direction away from the heat dissipation plate in a state of being apart from the heat dissipation plate, the first terminal being connected via a first electric conductor to surfaces of the plurality of switching elements on an opposite side to the heat dissipation plate side;
• a sealing member sealing the plurality of switching elements, the heat dissipation plate, and the first terminal;
• and
• a sense element disposed on the one surface of the heat dissipation plate adjacently to the notch, wherein
• a notch is provided in an outer periphery portion of the heat dissipation plate, and
• a portion of the first terminal on the heat dissipation plate side overlaps with a region of a cut at the notch as seen in a direction perpendicular to the one surface of the heat dissipation plate.