Lead frame assembly having a plurality of dicing holes

A lead frame assembly, comprising:

• a lead frame body made of an electrically conductive material and including
• a plurality of lead frame units arranged in an array and connected to one another,
• an outer frame portion extending peripherally around the array of said lead frame units and being connected to a part of said lead frame units that are immediately adjacent to said outer frame portion, and
• a plurality of through holes formed on said outer frame portion;
• an encapsulant unit including a lower encapsulating portion which fills spaces formed in each of said lead frame units and between adjacent ones said lead frame units, and an upper encapsulating portion which is formed on a top surface of said lower encapsulating portion and which is partially formed on a top surface of each of said lead frame units;
• and
• a plurality of dicing positioning units respectively located at said through holes, each of said dicing positioning units including an adhesive layer which is formed with said encapsulant unit in a same process to partially fill a corresponding one of said through holes and which is formed with at least one dicing positioning hole that has a diameter smaller than a diameter of said corresponding one of said through holes, said dicing positioning units being configured to define at least one first dicing positioning line extending along a first direction and at least one second dicing positioning line extending along a second direction.