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US 12,112,993 B2Granted
Heat radiation member
AssigneeA.L.M.T. Corp.
InventorsRyota Matsugi, Isao Iwayama, Chieko Tanaka, Hideaki Morigami
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Abstract
A heat radiation member excellent in electrical insulation and better in thermal conduction is provided. The heat radiation member includes a substrate composed of a composite material containing diamond and a metallic phase, an insulating plate provided on at least a part of front and rear surfaces of the substrate and composed of an aluminum nitride, and a single bonding layer interposed between the substrate and the insulating plate, the heat radiation member having thermal conductivity not lower than 400 W/m·K.
Claims4
A heat radiation member for a semiconductor element comprising:
- a substrate composed of a composite material containing diamond and a metallic phase;
- an insulating plate provided on a surface of the substrate and composed of aluminum nitride;
- and
- a single bonding layer formed on the surface of the substrate, interposed between the substrate and the insulating plate,
- wherein a constituent metal of the metallic phase is pure silver or a silver-based alloy,
- the bonding layer is composed of an alloy containing Ag, Cu, and Ti, and
- a concentration of the Ti in the bonding layer is not lower than 40 atomic % and not higher than 95 atomic % with a total amount of Ag, Cu, and Ti being defined as 100 atomic %.
4 more elements
Dependencies are inferred from the claim text.