Rotating biasable pedestal and electrostatic chuck in semiconductor process chamber

A substrate support for use in a chemical vapor deposition (CVD) chamber, comprising:

• a pedestal to support a substrate, wherein the pedestal includes a dielectric plate coupled to a pedestal body, wherein the pedestal comprises a monopolar electrode or bipolar electrodes, wherein the pedestal further comprises an insulator plate disposed between the dielectric plate and the pedestal body, wherein the insulator plate substantially covers a lowermost surface of the dielectric plate;
• a rotary union coupled to the pedestal, wherein the rotary union includes a stationary housing disposed about a rotor;
• a drive assembly coupled to the rotary union and configured to rotate the rotor to rotate the pedestal;
• a coolant union coupled to the rotary union and having a coolant inlet fluidly coupled to coolant channels disposed in the pedestal via a coolant line;
• an RF rotary joint coupled to the coolant union and having an RF connector configured to couple the pedestal to an RF bias power source;
• an RF conduit that extends from the RF connector to the pedestal through a central opening of the pedestal body;
• an insulator tube disposed about the RF conduit to insulate the RF conduit, wherein the insulator plate extends radially inward to the insulator tube;
• and
• a ground tube disposed about the insulator tube and extending from the RF rotary joint towards the pedestal, wherein the insulator tube extends vertically above an upper surface of the ground tube.

A chemical vapor deposition (CVD) process chamber, comprising:

• a chamber body defining an interior volume therein;
• a showerhead disposed in the interior volume for supplying one or more process gases into the interior volume;
• a substrate support disposed in the interior volume opposite the showerhead, wherein the substrate support comprises:
• a pedestal to support a substrate, wherein the pedestal includes a dielectric plate coupled to a pedestal body;
• a rotary union coupled to the pedestal, wherein the rotary union includes a stationary housing disposed about a rotor;
• a drive assembly coupled to the rotary union and configured to rotate the rotor to rotate the pedestal;
• a coolant union coupled to the rotary union and having a coolant inlet fluidly coupled to coolant channels disposed in the pedestal via a coolant line;
• an RF rotary joint coupled to the coolant union, wherein the RF rotary joint includes an RF housing, an RF connector disposed in the RF housing, an insulated adapter ring disposed about a lower portion of the coolant union, and a mounting ring coupled to the RF connector and insulated adapter ring, wherein the RF connector includes an upper portion and a lower portion exposed to inner sidewalls of the RF housing, the lower portion configured to rotate with respect to the upper portion;
• an RF conduit that extends from the RF connector to the pedestal through a central opening of the pedestal body;
• an insulator tube disposed about the RF conduit, wherein portions of the insulator tube disposed in the dielectric plate is wider than portions of the insulator tube disposed in the pedestal body;
• and
• a ground tube disposed about the insulator tube and extending from the RF rotary joint to the rotary union, wherein the insulator tube extends vertically above an upper surface of the ground tube;
• and
• an RF bias power source coupled to the RF conduit and configured to provide RF power to an electrode disposed in the dielectric plate via the RF conduit.