Wafer supporting mechanism and method for wafer dicing
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsBo Hua Chen, Yan Ting Shen, Fu Tang Chu, Wen-Pin Huang
Life of this patent
Estimating the term…
Abstract
A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.
Claims17
A wafer supporting mechanism, comprising:
- a carrier configured to support a wafer carrying at least one semiconductor device on a first surface of the wafer;
- and
- a cushion element configured to cover a portion of the wafer,
- wherein the carrier comprises a base portion and a support portion protruded beyond a peripheral region of the base portion, and the base portion and the support portion collectively define an accommodation space for accommodating the cushion element and the at least one semiconductor device, and
- wherein the cushion element is received within the accommodation space and configured to support the wafer to prevent warpage of the wafer during a wafer dicing process.
A wafer supporting mechanism, comprising:
- a base portion;
- a support portion connected to the base portion, wherein an accommodation space is defined by the base portion and the support portion, the accommodation space is configured to accommodate a semiconductor device attached to a wafer, and the semiconductor device is accommodated between a top surface of the support portion and a top surface of the base portion;
- and
- a gas channel within the support portion and having an outlet, wherein the outlet is exposed by the top surface of the support portion and configured to fix a peripheral region of the wafer,
- wherein the wafer supporting mechanism is configured to support a bottom surface of the wafer and a bottom surface of the semiconductor device, and wherein the bottom surface of the wafer and the bottom surface of the semiconductor device are at different elevations, and wherein a plurality of the semiconductor devices are attached to and protruded beyond the bottom surface of the wafer, and the base portion contacts at least one of bottom surfaces of the plurality of the semiconductor devices.
A wafer supporting mechanism, comprising:
- a cavity table, comprising:
- a first support wall;
- and
- a gas channel in the first support wall and configured to match a peripheral region of a wafer, wherein the cavity table comprises at least one accommodation space recessed from a top surface of the cavity table for accommodating a plurality of semiconductor devices on a surface of the wafer facing the at least one accommodation space,
- wherein, in a cross-sectional view, the cavity table further comprises a base plate and a plurality of supporters, and the supporters are within the at least one accommodation space and configured to contact the wafer without contacting the semiconductor devices when the wafer and the semiconductor devices are supported by the wafer supporting mechanism;
- and
- a base portion comprising a channel and an outlet connected to the channel, and the supporters are fixated to the base portion through vacuum suction provided by the channel.
Dependencies are inferred from the claim text.