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US 12,112,964 B2Granted
Chip carrier, chip testing module, and chip handling module
AssigneeChroma Ate Inc.
InventorsSheng-Hung Wang, Po-Hsiang Chang, Zhe-Min Liao
Life of this patent
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Abstract
The invention provides a chip carrier, a chip testing module and a chip handling module. The chip carrier for carrying a plurality of chips comprises a main body with an upper surface and a lower surface. The main body has a plurality of air guide holes, and two ends of each air guide hole are respectively exposed on the upper surface and the lower surface. A part of the air guide holes are defined as a first group, and the air guide holes of the first group are connected. The main body is made of conductive material.
Claims7
A chip carrier for carrying a plurality of chips, comprising:
- a main body with an upper surface and a lower surface;
- wherein the main body has a plurality of air guide holes, and two ends of each air guide hole are respectively exposed on the upper surface and the lower surface;
- wherein a part of the air guide holes are defined as a first group, and the air guide holes of the first group are connected;
- wherein the main body is made of conductive material,
- wherein the main body has a first recess, and the first recess is used to connect with the air guide holes of the first group.
2 more elements
Dependencies are inferred from the claim text.