Arrangement apparatus and arrangement method
AssigneeKabushiki Kaisha Shinkawa
InventorKohei Seyama
Life of this patent
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Abstract
An arrangement apparatus includes a stage, an arrangement part, and a control part. The stage supports a substrate. The arrangement part holds a die and arranges multiple dies on the substrate supported by the stage. The control part has a map data indicating arrangement positions of the dies and generated based on a positional relationship among patterns formed by an exposure apparatus, and controls, based on the map data, relative positions between the stage and the arrangement part when arranging the dies on the substrate.
Claims8
An arrangement apparatus which arranges a plurality of dies on a substrate in correspondence with a plurality of patterns so as to bond to a wafer having the patterns formed by an exposure apparatus, the arrangement apparatus comprising:
- a stage which supports the substrate;
- an arrangement part which holds the die and arranges the dies on the substrate supported by the stage;
- and
- a control part which has a map data indicating arrangement positions of the dies and generated based on a positional relationship among the patterns formed by the exposure apparatus, and controls, based on the map data, relative positions between the stage and the arrangement part when arranging the dies on the substrate.
An arrangement method of arranging a plurality of dies on a substrate in correspondence with a plurality of patterns so as to bond to a wafer having the patterns formed by an exposure apparatus, the arrangement method comprising:
- a step of acquiring a map data indicating arrangement positions of the dies based on measurement of positions of the patterns on the wafer on which the patterns are formed by the exposure apparatus;
- and
- a step of arranging the dies on the substrate based on the acquired map data.
Dependencies are inferred from the claim text.