Wafer processing system

A wafer processing system at least comprising:

• at least one processing tank having a cantilever rotating device and a dynamic balance correction device, the cantilever rotating device having a holding part for holding a wafer of a variety of specification parameters and causing the wafer to rotate along a rotating shaft of the cantilever rotating device, wherein the dynamic balance correction device performs a corresponding dynamic balance correction on the cantilever rotating device, so that the cantilever rotating device is in a dynamic balance state during rotation;
• a cleaning device having at least one dynamic nozzle unit, the dynamic nozzle unit correspondingly adjusting at least one operating parameter according to the specification parameters of the wafer, and ejecting a cleaning fluid to the wafer to perform a cleaning procedure when the cantilever rotating device rotates;
• and
• a drying device used to perform a drying procedure on the wafer processed by the cleaning procedure when the cantilever rotating device rotates.