Semiconductor devices and methods of manufacturing

A method of manufacturing a semiconductor device, the method comprising:

• dispensing a first etchant and a second etchant over a semiconductor substrate, wherein the semiconductor substrate is located at different distances away from a horizontal plane during the dispensing of the first etchant and the dispensing of the second etchant;
• and
• dispensing a rinse liquid over the semiconductor substrate between the dispensing the first etchant and the dispensing the second etchant, wherein the semiconductor substrate is at a different distance from the horizontal plane during the dispensing the rinse liquid than during the dispensing the first etchant and the dispensing the second etchant;
• and
• catching the first etchant, the second etchant, and the rinse liquid in respective, separated tiers of a multi-tier return system.