Cathode unit for magnetron sputtering apparatus and magnetron sputtering apparatus

A cathode unit for a magnetron sputtering apparatus comprising:

• a backing plate joined to an upper side opposed to a sputtering surface of a target set in a posture facing an inside of a vacuum chamber and comprising two support plates that are joined together, wherein a refrigerant passage is formed by the two support plates;
• and
• a magnet unit disposed above the backing plate at an interval, the refrigerant passage through which a refrigerant configured to flow at a first pressure on an upper inner surface of the backing plate by an inflow port and an outflow port,
• wherein a surface pressure applying unit is provided, the surface pressure applying unit applying, toward an upper outer surface of the backing plate at a second pressure on the upper outer surface, the second pressure equivalent to the first pressure by the refrigerant applied to the upper inner surface of the backing plate when the refrigerant is circulated, and
• wherein the surface pressure applying unit includes a magnet case filled with the refrigerant and having a sealed structure that is connected to an upper outer surface of the backing plate and that stores the magnet unit, and the refrigerant is directly contacting the magnet case,
• wherein a circulating unit that is connected to the magnet case is provided, the refrigerant between the magnet case and a fluid supplying unit being circulated to flow at the second pressure on the upper outer surface of the backing plate by an inflow port and an outflow port,
• the magnet case, the inflow port, and the outflow port connects a chiller unit of the circulating unit and the upper outer surface backing plate.