Ceramic electronic device and manufacturing method of the same

A manufacturing method of a ceramic electronic device comprising:

• preparing a ceramic multilayer structure having a substantially rectangular parallelepiped shape in which dielectric green sheets including a main component ceramic and metal conductive pastes for internal electrode layers including Ni as a main component metal are alternately stacked, the metal conductive pastes being alternately exposed to two end faces of the ceramic multilayer structure opposite to each other;
• forming a multilayer chip by firing the ceramic multilayer structure;
• providing metal conductive pastes for base layers contacting the two end faces, a main component metal of the metal conductive paste for base layers being Cu powder, an amount of Ni powder of the metal conductive paste for base layers being 1 wt % or more and 5.0 wt % or less on a presumption that an amount of Cu is 100 wt %;
• and
• firing the metal conductive pastes for base layers.

A ceramic electronic component device:

• a multilayer chip having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, a main component of the dielectric layers being ceramic, a main component of the internal electrode layers being Ni, the internal electrode layers being alternately exposed to two end faces of the multilayer chip opposite to each other;
• and
• external electrodes, each of which is provided on each of the two end faces,
• wherein each of the external electrodes includes a base layer contacting the internal electrode layers, a main component of the base layer being Cu, and
• wherein the base layer includes Ni of 1 wt % or more and 10 wt % or less on a presumption that an amount of Cu is 100 wt %, and the base layer includes an oxide including Ni and Zn.

A manufacturing method of a ceramic electronic device comprising:

• preparing a ceramic multilayer structure having a substantially rectangular parallelepiped shape in which dielectric green sheets including a main component ceramic and metal conductive pastes for internal electrode layers including Ni as a main component metal are alternately stacked, the metal conductive pastes being alternately exposed to two end faces of the ceramic multilayer structure opposite to each other;
• forming a multilayer chip by firing the ceramic multilayer structure;
• providing metal conductive pastes for base layers contacting the two end faces, a main component metal of the metal conductive paste for base layers being Cu powder, an amount of Ni powder of the metal conductive paste for base layers being 1 wt % or more and 10 wt % or less on a presumption that an amount of Cu is 100 wt %;
• and
• firing the metal conductive pastes for base layers;
• wherein the base layer includes an oxide including Ni and Zn.