Multilayer electronic component

A multilayer electronic component comprising:

• a body including a dielectric layer and a first internal electrode and a second internal electrode alternately disposed with the dielectric layer interposed therebetween, the body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction;
• a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface;
• a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface;
• an insulating layer disposed on the second surface and extending onto the first and second connection portions;
• a first plating layer disposed on the first band portion;
• and
• a second plating layer disposed on the second band portion,
• wherein the insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.